On November 4, 2021, Amkor, a semiconductor product packaging and testing service provider, announced that it plans to build a new intelligent packaging and testing factory in Bac Ninh, Vietnam.
Image source: Screenshot of Amkor’s official website
According to official information, the first phase of the new facility will focus on providing advanced system-in-package (SiP) packaging and test solutions to the world’s leading semiconductor and electronics manufacturing companies. The investment in the first phase is estimated to be between 200 million and 250 million US dollars, and the clean room area is about 20,000 square meters. Construction is expected to start in 2022, and mass production will begin in the second half of 2023.
It is reported that Amkor is headquartered in Tempe, Arizona and has factories in many countries around the world, such as China, the Philippines, South Korea, Japan, etc.
Earlier news said that both ON Semiconductor and Intel had traveled to Vietnam to set up factories. In 2014, ON Semiconductor announced the construction of packaging and testing plants in Binh Duong and Dong Nai, Vietnam. According to ON Semiconductor, the two packaging and testing plants produce hybrid integrated circuits (HICs) and discrete power semiconductor solutions for automotive, white goods and industrial applications.
In 2006, Intel announced that it would invest US$1 billion to build an advanced chip packaging and testing plant in Saigon High-Tech Park (SHTP), Ho Chi Minh City, southern Vietnam. On January 26 this year, Intel once again invested an additional US$475 million in Intel Products Vietnam (IPV), a packaging and testing factory in Vietnam. This brings Intel’s total investment in the Vietnam factory to $1.5 billion.