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Power management based on big data, artificial intelligence and cloud computing

With the development of technologies such as big data, artificial intelligence, and cloud computing, processors have shown a completely different development direction from the past. Including CPU, GPU, FPGA and all kinds of AI processors are increasing at an unprecedented speed. The performance has been greatly improved, and the power consumption has also been greatly increased. In addition, the space left for power supply and other functions in the server is getting smaller and smaller. The development cycle is becoming more and more stringent, which brings new technical challenges to power management.

With the development of technologies such as big data, artificial intelligence, and cloud computing, processors have shown a completely different development direction from the past. Including CPU, GPU, FPGA and all kinds of AI processors are increasing at an unprecedented speed. The performance has been greatly improved, and the power consumption has also been greatly increased. In addition, the space left for power supply and other functions in the server is getting smaller and smaller. The development cycle is becoming more and more stringent, which brings new technical challenges to power management.

“Agility (fast), Efficient (high efficiency), Integration (integration), Scalable (expandable) are the most important requirements for cloud computing power.” MPS high current module product manager Yang Heng said.

In conjunction with MPS products, Yang Heng specifically explained the innovations that power management manufacturers need to achieve in response to the four major needs.

Yang Heng first stated that the power R&D cycle needs to be continuously shortened, especially for accelerator cards, the market window will soon be closed. After the customer gets the chip, they start to pass the discrete solution, starting from the selection and procurement, including loop compensation, design layout, layout and wiring, and even repeated verification, which takes several weeks. With the power module solution, the selection, procurement and schematic design can be completed within two weeks, and the plate making and assembly can be completed in 1 to 3 weeks, which greatly shortens the development cycle and enables customers to focus more on differentiated accelerator card design .

Development cycle comparison of power modules and traditional discrete devices

With more and more core types of large-scale chips, the core voltages are not exactly the same, so a variety of voltage rails and input currents are required. Secondly, for different application scenarios, the load rate is different, and the power consumption requirements are also different. Third, in order to achieve a higher energy efficiency ratio, the main chip often adjusts the power consumption automatically according to the load and application, so a higher dynamic range is also required.

Yang Heng gave an example, for example, for a certain FPGA, the input voltage is 0.72V, and the full load current is 180A. When the load changes from 0A to 100A, the di/dt needs to reach a speed of 100A/μs, and the peak-to-peak value should not exceed ±3%.

The MPM3695-100 high-current expandable module can meet the high-response, high-current power supply requirements. Using MPS’s unique COT (constant-on-time) and MCOT (multi-phase constant-on-time) control methods, the clock frequency can be adjusted when it is dynamic, which greatly increases the dynamic response performance and greatly reduces the output The number of capacitors.

As shown in the figure, through MPS actual measurement, from 32A to 128A, two 3695-100 modules are connected in parallel to ensure that the output voltage does not exhibit excessive drift, and the dynamic response is fast enough. The 3695-100 supports up to 8 parallel connections to achieve scalability. Customers can flexibly configure power modules according to their own needs.

At the same time, compared with the traditional discrete system, the power module greatly reduces the complexity, including the compensation circuit, MOS, etc. Through high integration, a higher power density is achieved, and the PCB layout area is reduced. It is very suitable for occasions such as servers or PCIe cards that have extremely demanding area requirements.

For greater flexibility, the industry’s first four-way power supply module MPM82504 perfectly interprets this advantage. As shown in Figure 2, this product is a four-way 25A power supply module, which can realize two-way and three-way in parallel at the same time. Four channels, or multiple MPM82504 modules can be connected in parallel to achieve a more flexible output combination. Other features are similar to MPM3695-100, support 4V-16V input; 0.5V-3.3V output.

Compared with MPM3695-100, the particle size is finer, so it can meet the power demand of accelerating the fine particle size of the chip.

At the same time, MPS also introduced the dual 12A + dual 5A power supply MPM81204, which supports 3V to 16V input voltage, can support 0.6V to 3.3V output voltage on the 12A channel, and 0.6V to 0.6V on the two 5A output channels. 5V output voltage.

The 4-channel 5A MPM54504 supports 3.3V to 16V input voltage and 0.6V to 5V output voltage. The continuous output current is 5A, and the peak value can be as large as 6A.

The MPM3690 dual 13A power module includes two versions AB, the A version is dual independent, and the B version is dual parallel, which can support higher current.

The above products all provide different timing pins for each output, which can facilitate timing control.

In addition, Yang Heng emphasized that MPS has adopted a number of proprietary intellectual property technologies in the single-wafer manufacturing and packaging process to achieve a higher energy efficiency ratio and better heat dissipation performance.

Modular power supplies are rapidly becoming a hot spot in the market due to their better power density, simplified design, and smaller size. At present, in addition to high-power MPM series power modules, MPS also provides mEZ open-architecture power modules. Customized products provided by customers with small batches and relatively low power density requirements can also meet customers’ flexibility and convenient design. Requirements.

Nowadays, MPS’s power modules have been recognized by various cloud chip manufacturers and successfully entered the reference designs of many products. I believe that with the continued development of the cloud computing market in the future, MPS will be able to better meet customer needs through a product portfolio with high power density and high flexibility.

The Links:   PM150CVA120 AT25256A-10TU-27