For a long time, TSMC has “dominated” the semiconductor field with its strong semiconductor manufacturing capabilities. Just recently, it was reported that TSMC intends to fully enter the field of chip packaging and testing.
As we all know, TSMC has been focusing on semiconductor manufacturing for more than 30 years, and its market size has even exceeded 50%. Even if giants such as Samsung and SMIC are added together, their market share cannot be compared. Similarly, TSMC’s strong semiconductor manufacturing capabilities can also provide huge packaging and testing orders for many packaging and testing manufacturers. Now if TSMC plans to do its own packaging and testing, it will undoubtedly bring about major changes in the original packaging and testing industry structure.
According to the data, TSMC itself has quite good packaging capabilities. As early as 2012, TSMC began large-scale production of CoWoS (Chip-on-Wafer-on-Substrate) chip packaging technology, which is a technology that packages chips and substrates together, and is carried out at the wafer level. , and it is said that only TSMC currently has it, which is very confidential.
CoWoS chip packaging technology belongs to 2.5D packaging technology, which is often used in the integrated packaging of HBM high-bandwidth memory, such as AMD Radeon VII game card and NVIDIA V100 computing card. It was first used by TSMC to package 28nm process chips. In 2014, TSMC took the lead in realizing the application of CoWoS packaging technology on 16nm chips.
In 2015, TSMC developed the CoWoS-XL packaging technology and put it into large-scale production in the second half of 2016. 20nm, 16nm, 12nm and 7nm chip packaging all use this technology.
Today, according to industry chain sources, TSMC’s sixth-generation CoWoS chip packaging technology will be put into mass production in 2023.
The news about TSMC’s full-scale entry into the construction of a packaging and testing plant may not be groundless. Xu Yaochang, the mayor of Taiwan’s Miaoli County, said on Facebook that TSMC made a decision by investing in an advanced packaging and testing plant located in Zhunan Town, Miaoli County. Xu Yaochang said that the Jiekuo factory on the north side of the packaging and testing factory is expected to be completed in May 2021, and the first phase of the factory will be operational in 2021, and it is initially expected to provide 1,000 jobs. The packaging and testing plant is expected to have a total investment of about NT$303.2 billion (approximately RMB 72.2 billion), which is also the largest single investment in Taiwan’s history.
It is reported that the purpose of building the packaging and testing factory is to help TSMC enter high-end IC packaging and testing services to provide one-stop services with advanced 3D packaging and testing technology.